EMI/RFI: Materials and Technologies
| Product Code | BCC00138 |
| Publication Date | April 2011 |
| Publisher | BCC Research |
| Product Type | Report |
| Pages | 244 |
| ISBN Number | not applicable |
EMI/RFI: Materials and Technologies
REPORT HIGHLIGHTS
- Global demand for EMI/RFI shielding options is estimated at about $4.5 billion in 2011 and is expected to increase to $5.2 billion by 2016, a projected compound annual growth rate (CAGR) of 2.8%.
- Metal cabinets will show the largest growth over the forecast period due to several factors, particularly the increased use of higher frequencies. This sector is valued at $649 million in 2011 and is expected to increase at a 3.1% compound annual growth rate (CAGR) to reach $755 million in 2016.
- The laminates/tapes market will experience the most significant growth, a 6.2% compound annual growth rate (CAGR) over the forecast period. This sector is worth an estimated $129 million in 2011 and is expected to reach $174 million in 2016.
REPORT SCOPE
INTRODUCTION
STUDY OBJECTIVES
This study is an updated version of a report published in 2007. The objective of this report is to review and analyze electromagnetic interference (EMI) and radio frequency interference (RFI) problems that are encountered in operation of electronic equipment and implications for plastics and competitive materials/technologies used to suppress that interference.
There are several important differences between the shielding industry of today compared with several years ago, led by the increased number and quality of devices and components requiring shielding.
Another issue is the ever-increasing frequencies being encountered along with the proliferation of wireless devices that may result in shifting of shielding options. In addition, the impact of other technologies such Bluetooth, absorptive EMI, fiber optics, and others will be assessed. This study will analyze effects on material usage caused by these and other issues.
SCOPE AND FORMAT
The size and the growth of the global market for EMI/RFI shielding products is a function of several factors. Shielding not only closely follows the demand for electronic devices and components but also is a valuable resource to assist manufacturers in complying with ever-changing safety and performance regulations. Consequently, the study summarizes the somewhat muddled global regulatory environment.
The overview identifies the nature of the EMI/RFI problem, noting how shielding and electronics redesign can, in some instances, overcome these problems. Technologies and materials specific to EMI/RFI shielding are identified and analyzed for their impact on plastics and other materials within a context of trends in components and devices used in the electronics and other industries such as medical, automotive, and consumer products.
The report begins with an understanding of the issues involved, current state of the electronics and other industries, market for plastics-based shielding options, key participants, shielding technologies, patents, materials, shielding components, a "time line" of global developments, and worldwide regulatory and standards environment for electronic shielding.
Compound annual growth rates (CAGRs) are provided by square feet and 2011 dollars. An analysis based on volume is not feasible because of the many disparate shielding products.
METHODOLOGY
Both primary and secondary research methodologies were used in preparing this report. Specifically, the following procedures were used to gather information:
- A review of EMI supplier literature
- An analysis of the electronic industry in terms of EMI shielding
- Contacts with EMI suppliers, trade associations, editors of trade magazines, and other knowledgeable sources.
CONTRIBUTION OF THE STUDY
With each successive analysis, BCC Research updates participants in the plastics and electronics industries on evolving needs for plastics EMI shielding in enclosures for electronic equipment being manufactured. Advantages and disadvantages, plus overall cost-effectiveness of the various materials and techniques that electronics original equipment manufacturers (OEMs) and systems assemblers are utilizing to shield their plastic enclosure parts, are reported.
This market research offers resin manufacturers, plastics compounders, and plastics processors with an analysis of factors that impact on their ability to serve the electronics industry with neat and/or filled resins. Concurrently, electronics design engineers and electronics OEMs, and assemblers can evaluate cost/performance advantages of various plastics shielding methods for their particular applications.
ANALYST'S CREDENTIALS
Research analyst Mel Schlechter has more than 40 years in the chemical industry and specializes in plastics market research. He has been with BCC Research for more than 10 years and holds a BS in chemistry, an MS in organic chemistry, and an MBA in marketing.
Contents
- CHAPTER ONE: INTRODUCTION
- STUDY OBJECTIVES
- SCOPE AND FORMAT
- METHODOLOGY
- CONTRIBUTION OF THE STUDY
- ANALYST'S CREDENTIALS
- RELATED BCC REPORTS
- BCC ONLINE SERVICES
- DISCLAIMER
- CHAPTER TWO: SUMMARY
- SUMMARY
- SUMMARY TABLE GLOBAL EMI/RFI SHIELDING BY METHOD, THROUGH 2016 ($ MILLIONS)
- SUMMARY FIGURE GLOBAL EMI/RFI SHIELDING BY METHOD, 2010-2016 ($ MILLIONS)
- SUMMARY (CONTINUED)
- CHAPTER THREE: PRINCIPLES OF ELECTROMAGNETISM
- SYMBOLS AND TERMINOLOGY
- ELECTROMAGNETIC ENERGY
- RADIATION
- CONDUCTION
- IMPEDANCE
- ELECTROSTATIC DISCHARGE (ESD)
- ELECTROMAGNETIC FIELDS
- ELECTROMAGNETIC INTERFERENCE AND RADIO FREQUENCY INTERFERENCE
- SUMMARY OF DEFINITIONS AND RANGES
- CHAPTER FOUR: MECHANISMS OF SHIELDING
- OVERVIEW
- BACKGROUND
- MAJOR EMI PROBLEM AREAS
- OVERVIEW OF EMI SHIELDING
- SHIELDING EFFECTIVENESS
- ATTENUATION
- ELECTROMAGNETIC COMPATIBILITY
- EMC CONTROL
- SHIELDING PERFORMANCE
- OVERVIEW
- ABSORPTION
- REFLECTANCE
- PERMEABILITY
- GALVANIC CORROSION AND METALS COMPATIBILITY
- RELATIONSHIP BETWEEN CONDUCTIVITY AND RESISTIVITY
- EFFECTS OF EMI/RFI AND STATIC ELECTRICITY
- BACKGROUND
- THE IMPORTANCE OF RADIO FREQUENCY RANGES
- CONTROLLING EMI/RFI
- Background
- Review and Summation of EMI Technology
- Use of Thermoplastics
- EMI Shielding Compounds versus Coatings
- CHAPTER FIVE: SHIELDING TECHNOLOGIES AND MATERIALS
- OVERVIEW
- FARADAY CAGES/SHIELDS
- COST AND PERFORMANCE CHARACTERISTICS OF THE SHIELDING OPTIONS
- COST COMPARISONS
- PERFORMANCE COMPARISONS
- EMC SHIELDING NEEDS TO KEEP UP WITH END-USER REQUIREMENTS
- METALLIZATION PROCESSES
- BACKGROUND
- OVERVIEW
- METALLIZATION MATERIALS
- SHIELDING EFFECTIVENESS OVERVIEW BY TYPE OF COATING
- CONDUCTIVE PLASTICS
- OVERVIEW
- BACKGROUND
- FORMULATION OPTIONS
- HOW DO CONDUCTIVE PLASTICS WORK?
- DIELECTRIC PROPERTIES OF PLASTICS
- TECHNIQUES FOR MAKING PLASTICS CONDUCTIVE
- TYPES OF CONDUCTIVE MATERIALS
- FUNCTIONS
- CONDUCTIVE ADDITIVE SELECTION
- CONDUCTIVITY TESTS
- REVIEW OF ADVANTAGES AND DISADVANTAGES
- Review of Advantages ... (Continued)
- COMPOUNDING CONDUCTIVE PLASTICS
- EXAMPLES OF COMPANIES PRODUCING CONDUCTIVE PLASTICS
- CONDUCTIVE PLASTIC ADDITIVES
- Overview
- Background
- Fibers and Powders
- Silver Coatings
- Carbon Fibers and Powders
- Overview
- Carbon Fibers
- Carbon Blacks
- Metal Fibers
- Overview
- Advantages
- Metal Fiber Conductivity
- Metallized Glass Fibers
- Nickel-Coated Graphite Fibers
- Background
- Advantages
- Stainless Steel Fibers
- Overview
- Technology
- Affect on Processing
- Fiber Forms
- Advantages and Disadvantages
- Copper Fibers
- Conductive Filler Suppliers
- CARBON NANOTUBES
- Overview
- Overview (Continued)
- Usage in Producing Electrically Conductive Composites
- Overview
- Technical Problems
- Carbon Nanotube Producers/Suppliers
- New Developments in Carbon Nanotubes
- BASF Introduces Conductive Plastics Using Carbon Nanotubes
- Hyperion New Applications
- Aerospace Applications
- Eikos Receives Funds for U.S. Navy Research
- Nanocomp Technologies Secures Air Force Contract
- Other Brief Developments Related to Carbon Nanotube-Based Electromagnetic Compliance Include
- CONDUCTIVE PLASTICS TECHNICAL ISSUES
- CONDUCTIVE FILMS
- OVERVIEW
- EXAMPLES OF COMPANY PRODUCTS
- Donatech VCF Series
- Z-Flo Conductive Films
- INHERENTLY CONDUCTIVE POLYMERS
- BACKGROUND
- POTENTIAL APPLICATIONS
- POLYANILINES
- OTHER TYPES OF ICPS
- PRICING
- PROSPECTS
- COMPARISON OF CONDUCTIVITIES OF ICPS WITH METALS, SEMICONDUCTORS, AND INSULATORS
- PROCESSING OPTIONS FOR ICPS
- RECENT ACTIVITIES AND DEVELOPMENT
- H.C. Starck Activities
- Polyanilines for EMI Shielding
- Other Academic Advances
- CONDUCTIVE ELASTOMERS
- OVERVIEW
- TECHNOLOGY AND APPLICATIONS RELATED TO EMI
- EXAMPLES OF CONDUCTIVE ELASTOMER PRODUCTS
- Conductive Composites-Midway, Utah
- Laird Technologies-Chesterfield, Missouri
- Leader Tech-Tampa, FL
- CONDUCTIVE COATINGS
- INTRODUCTION
- BACKGROUND
- EMI SHIELDING COMPOUNDS COMPARED WITH CONDUCTIVE COATINGS
- CONDUCTIVE COATING ISSUES
- COMPARISON OF CONDUCTIVE COATINGS
- PERFORMANCE OF ALTERNATE CONDUCTIVE COATINGS
- ADVANTAGES AND DISADVANTAGES
- PROS AND CONS OF CONDUCTIVE COATINGS
- CONDUCTIVE COATING COST COMPARISONS
- COATING BINDERS
- SOLVENT-BASED VERSUS WATERBORNE CONDUCTIVE COATINGS
- COPPER, NICKEL, AND SILVER USAGE
- Advantages of Copper versus Nickel
- Advantages of Nickel versus Copper
- Silver
- Summary of Attributes of the Major Metal Combinations Used as Conductive Materials
- ELECTROPLATED COATINGS
- ELECTROLESS PLATING
- BACKGROUND
- OVERVIEW
- ATTRIBUTES
- REVIEW OF TECHNOLOGY DETAILS
- METALS INVOLVED
- ADVANTAGES AND DISADVANTAGES
- PLASTIC SUBSTRATES
- APPLICATIONS
- MULTILAYERS
- MEASURING SHIELDING EFFECTIVENESS
- DIRECT PLATE
- SELECTED COMPANIES INVOLVED IN ELECTROLESS PLATING
- VACUUM METALLIZATION
- BACKGROUND
- TECHNOLOGY
- ADVANTAGES AND DISADVANTAGES
- INDUSTRY TEST METHODS
- VACUUM METALLIZATION PROCESSES
- Direct Thermal Evaporation
- Electron Beam Coatings
- Cathode Sputtering
- CONDUCTIVE PAINTS
- OVERVIEW
- COPPER
- SILVER
- NICKEL
- TECHNOLOGIES INVOLVED
- SOLVENT VERSUS WATERBORNE
- PAINT THICKNESSES
- OTHER VARIABLES
- APPLICATION OF CONDUCTIVE PAINTS
- SHIELDING PERFORMANCE
- CONDUCTIVE PAINT COST COMPARISONS
- SELECTED TECHNICAL ADVANCES IN CONDUCTIVE PAINT TECHNOLOGY
- COMPANIES INVOLVED IN CONDUCTIVE PAINTS
- THERMAL (ARC) SPRAY
- OVERVIEW
- TECHNOLOGY
- ADVANTAGES AND DISADVANTAGES
- IMPROVEMENTS IN THE PROCESS
- EXAMPLES OF COMPANIES INVOLVED
- METALLIZED FOIL LAMINATES AND TAPES
- OVERVIEW
- FLEXIBLE FOIL LAMINATES
- ADHESIVE METAL TAPES
- FABRIC TAPES
- EXAMPLES OF COMPANY PRODUCTS
- The 3M Company
- EGC Enterprises' Tapes
- Acofab Products
- Conductive Foils, Tapes, and Films from Turkey
- Electronic Tapes
- EMI Shielding Laminates
- Venture Tape Products
- SOFT FERRITES
- OVERVIEW
- BACKGROUND
- PROPERTIES
- CHOOSING FERRITES FOR EMI SUPPRESSION
- TYPES OF FERRITE SHAPES AND APPLICATIONS
- COMPANIES MARKETING SOFT FERRITES
- CHAPTER SIX: SHIELDING COMPONENTS
- GASKETS
- BACKGROUND
- TECHNOLOGY
- ESSENTIAL FEATURES IN EVALUATING EMI GASKETS
- Shielding Effectiveness
- Operating Conditions
- Compression/Deflection
- Compression Set
- PROPERTIES
- SELECTING GASKET TYPES
- GASKET TYPES BY MATERIAL
- Background
- Conductive Fabric over Foam (Fabric-Clad Foam) Gaskets
- Stamped and Formed Metal Gaskets (Be/Cu Fingerstock)
- Conductive Elastomer Gaskets
- Wire Mesh Gaskets
- SOME TECHNICAL AND COMMERCIAL CONSIDERATIONS
- INSTALLATION COST
- SHIELDING GASKETS FOR HIGHER FREQUENCIES
- TESTING
- NEW DEVELOPMENTS
- EMI Shielding Gaskets Can Survive Difficult Environments
- New 3M Gasket Materials for Shielding Applications
- Laird Technologies New Multiextension Shielding Gaskets
- Conductive Foam Gaskets
- Slotless Low-Profile Gaskets
- FILTERS
- OVERVIEW
- BACKGROUND INFORMATION
- GUIDELINES FOR FILTER SELECTION
- LOSSY LINE OR DISSIPATIVE FILTERS
- NEW DEVELOPMENTS/PRODUCTS
- Corry Micronics, Inc.
- Crane Aerospace Introduces New Line of EMI Filters
- LCR Electronics New Metallized EMI Filters
- CONNECTORS AND CABLES
- BACKGROUND
- CABLE CONSTRUCTION
- EMI CABLE SHIELDING AND ABSORBING MATERIALS
- SHIELDING
- WINDOWS
- BACKGROUND
- MATERIALS USED
- SHIELDING PERFORMANCE
- MATERIAL ADVANTAGES AND DISADVANTAGES
- MAINTENANCE AND PERFORMANCE ISSUES
- SHIELDED WINDOW PRODUCERS
- NEW DEVELOPMENTS
- Parker Chomerics New Products
- ENCLOSURES
- BACKGROUND
- SOME PROBLEMS
- SOME TECHNOLOGY ISSUES
- AESTHETICS
- SHIELDING OF APERTURES
- EMI LEAKAGE
- ADVANTAGES AND DISADVANTAGES
- COST CONSIDERATIONS
- SUMMING UP THE ISSUES OF EMI AND SHIELDED ENCLOSURES
- SUPPLIERS OF SHIELDED ENCLOSURES
- NEW DEVELOPMENTS
- Schlegel Electronics Markets New Tape for Enclosure
- New Lightweight EMI Shielded Enclosure
- ARCHITECTURAL SHIELDING
- BACKGROUND
- BASIC ARCHITECTURAL SHIELDING OPTIONS
- SHIELDED ROOM CONSTRUCTION TYPES
- COMPONENTS
- NEW DEVELOPMENTS/PRODUCTS
- New Architectural Shielding System Provides Electromagnetic Field Protection
- COMPANIES INVOLVED
- EXAMPLES OF COMPANY PRODUCTS
- ETS-Lindgren
- Comtest Engineering
- OTHER SHIELDING COMPONENTS
- BRAIDS
- Background
- French Braid Shields
- FOIL SHIELDS
- Background
- Combination Foil/Braid Shields
- EMI Shielding Laminates
- ADHESIVES
- Overview
- Representative Products
- Conductive Adhesives and Sealants
- United Adhesives Products
- Pressure-Sensitive Tape Solutions
- EMI/RFI Tubular Braided EMI Shielding Products
- Shielding Laminates
- 3M Shielding Tapes
- Zippertubing Products
- CHAPTER SEVEN: EMI SHIELDING MARKETS
- BACKGROUND
- SHIELDING TYPE OVERVIEW
- REDESIGNING CIRCUITRY
- EMI SHIELDING TECHNOLOGY MARKET OVERVIEW
- ADVANTAGES/DISADVANTAGES OF MAJOR TYPES OF SHIELDING TECHNOLOGIES
- OFFSHORE SCENARIO
- CHAPTER EIGHT: THE EMI SHIELDING MARKET
- OVERVIEW
- EMI/RFI SHIELDING MARKET BY METHOD
- FIGURE 1 GLOBAL VALUE OF THE EMI/RFI SHIELDING MARKET, BY METHOD, THROUGH 2016 ($ MILLIONS)
- FIGURE 2 U.S. VALUE OF THE EMI/RFI SHIELDING MARKET, BY METHOD, 2010-2016 ($ MILLIONS)
- FIGURE 3 EUROPEAN VALUE OF THE EMI/RFI SHIELDING MARKET, BY METHOD, 2010-2016 ($ MILLIONS)
- FIGURE 4 ASIAN VALUE OF THE EMI/RFI SHIELDING MARKET, BY METHOD, 2010-2016 ($ MILLIONS)
- CONDUCTIVE COATING MARKET
- FIGURE 5 GLOBAL VALUE OF CONDUCTIVE COATING MARKET, 2010-2016 ($ MILLIONS)
- FIGURE 6 U.S. VALUE OF CONDUCTIVE COATING MARKET, 2010-2016 ($ MILLIONS)
- FIGURE 7 EUROPEAN VALUE OF CONDUCTIVE COATING MARKET, 2010-2016 ($ MILLIONS)
- FIGURE 8 ASIAN VALUE OF CONDUCTIVE COATING MARKET, 2010-2016 ($ MILLIONS)
- METAL CABINETS
- CONDUCTIVE PLASTICS
- MISCELLANEOUS EMI SHIELDING PRODUCTS
- CHAPTER NINE: ADDITIONAL PATTERNS AND USAGE OF SELECTED EMI SHIELDING PRODUCTS
- CONDUCTIVE COATINGS
- LAMINATES AND TAPES
- CONDUCTIVE PLASTICS AND ELASTOMERS
- OVERVIEW
- MISCELLANEOUS SHIELDING
- CHAPTER TEN: INDUSTRY COMMENTS ON THE FUTURE OF THE EMI/RFI MARKET
- HIGHER FREQUENCIES AND ABSORBENT EMC TECHNOLOGIES
- FIBER-OPTIC SYSTEMS
- CIRCUIT REDESIGN
- LOCATIONS
- WHAT ABOUT GROWTH AND WHERE
- CHAPTER ELEVEN: INDUSTRY/EMI SHIELDING INTERFACE
- ELECTRONIC INDUSTRY
- OVERVIEW
- TRENDS IN THE ELECTRONIC INDUSTRY
- EMI Shielding Considerations
- Impact of Standards
- MAJOR SEMICONDUCTOR COMPANIES
- TRANSPORTATION INDUSTRY
- OVERVIEW
- AUTOS
- Background
- Automotive EMI Shielding Overview
- Automotive EMC Standards
- AIRCRAFT
- Background
- The Aircraft Electromagnetic Environment
- Aircraft EMC Categories
- Aerospace/Aircraft EMC Compliance Standards
- A New Development
- HEALTHCARE INDUSTRY
- OVERVIEW
- POTENTIAL EMI PROBLEMS WITH MEDICAL IMPLANTS
- EFFORTS TO MINIMIZE EMI PROBLEMS IN THE MEDICAL ARENA
- WIRELESS ELECTRONIC EQUIPMENT EFFECTS IN HOSPITALS
- Background
- Wireless Phones and Hearing Aids
- Wireless Phones and Cardiac Pacemakers
- Wireless Phones and ICDs
- Cellular Phone Interference
- EXAMPLES OF CRITICAL HOSPITAL EMI AREAS
- MANAGING HOSPITAL EMC
- MATERIALS USED FOR SHIELDING MEDICAL DEVICES
- MEDICAL EMC STANDARDS
- Overview
- IEC 60601-1-2
- Other Standards for the Medical Industry
- NEW DEVELOPMENTS
- Higher Resolution Imaging and Other New Technologies Need to be Protected from EMI
- APPLIANCES
- OVERVIEW
- EMC COMPLIANCE
- OTHER CONSUMER PRODUCTS
- CHAPTER TWELVE: OTHER TECHNOLOGIES IMPACTING EMI/RFI MARKETS
- FIBER OPTICS
- OVERVIEW
- TECHNOLOGY
- Technology (Continued)
- FIBER OPTIC CURRENT SCENARIO
- Background
- Wireless Needs Fiber to Expand
- LAN WIRELESS TECHNOLOGIES
- NEW DEVELOPMENTS IN LAN
- New Wireless LAN Modules
- BLUETOOTH TECHNOLOGY
- OVERVIEW
- INTERFERENCE ISSUES
- MEDICAL APPLICATIONS
- AUTOMOTIVE APPLICATIONS
- ABSORPTIVE EMI CONTROL TECHNOLOGIES
- OVERVIEW
- TECHNOLOGY OF EMC ABSORBERS
- MARKETS
- COMPANIES INVOLVED IN MICROWAVE ABSORBERS
- EXAMPLES OF PRODUCTS USED AS MICROWAVE ABSORBERS
- Ferrites
- Microwave Foam Absorber Materials
- EMI Absorber Tubes
- CONCEPT OF HIGH FREQUENCIES
- OVERVIEW
- TRENDS
- SOME TECHNOLOGY DETAILS
- IMPACT OF OTHER SHIELDING CHOICES
- INTERNATIONAL STANDARDS ABOVE 1 GHZ
- International Standards Above 1 Ghz (Continued)
- CHAPTER THIRTEEN: RECENT PATENTS
- RECENT PATENTS
- BOARD-TO BOARD CONNECTOR ASSEMBLY WITH EMI SHIELDING
- TECHNIQUES FOR PROVIDING EMI SHIELDING WITHIN A CIRCUIT BOARD COMPONENT
- COMBINED BOARD-LEVEL EMI SHIELDING AND THERMAL MANAGEMENT
- EMI SHIELDING TECHNIQUES USING MULTIPLE EMI SHIELD WHICH SHARE THE SAME CIRCUIT BOARD HOLES
- DURABLE EMI SHIELDING FILM
- HIGH-DENSITY CONNECTOR WITH EMI SHIELDING
- EMI SHIELDING GASKETS
- METAL CAGE STRUCTURE AND METHOD FOR EMI SHIELDING
- COMPOSITE POLYMERIC MATERIAL FOR EMI SHIELDING
- METHODS AND APPARAUS FOR EMI SHIELDING IN MULTICHIP MODULES
- ELECTRONIC DEVICE WITH EMI ASSEMBLY
- TAMPER-EVIDENT TAPE WITH INTEGRATED EMI SHIELDING
- METHODS AND APPARATUS FOR EMI SHIELDING
- MULTIPIECE APPARATUS FOR THERMAL AND EMI SHIELDING ENHANCEMENT IN DIE-UP ARRAY PACKAGES
- LIQUID-COOLED RACK WITH PRECOOLER AND POST-COOLER HEAT EXCHANGERS USED FOR EMI SHIELDING
- CHAPTER FOURTEEN: ELECTROMAGNETIC COMPLIANCE (EMC) STANDARDS
- WHAT ARE ELECTRONIC STANDARDS?
- PURPOSE OF EMC STANDARDS/REGULATIONS
- SOME BASIC CONCEPTS
- COMPLIANCE TESTING AND CERTIFICATION
- OVERVIEW
- CRITICAL PATH FOR EMC
- SAFETY COMPLIANCE
- REGULATORY AND STANDARDS BODIES AND DIRECTIVES
- OVERVIEW
- REGULATORY AND STANDARDS BODIES
- SELECTED LIST OF EMC STANDARDS/DIRECTIVES
- CISPR (Which Relate to EMC Emission Test Methods and Limits)
- IEC Standards (Mostly Part of the IEC 61,000 Group)
- ISO Standards on Automotive EMC Issues
- European Standards Concerning Unwanted Electrical Emissions
- MILITARY/EMC STANDARDS/SPECFICATIONS
- ACTIVITIES FROM 2010 IEC (INTERNATIONAL ELECTROTECHNICAL COMMISSION) ADVISORY COMMITTEE ON EMC (ACEC)
- FDA UNITED STATES REQUIREMENTS
- OVERVIEW
- SUBASSEMBLIES
- OTHER ENVIRONMENTAL REGULATIONS
- BACKGROUND
- COMPLIANCE
- WEEE
- ROHS
- CHAPTER FIFTEEN: COMPANY PROFILES
- A.K. STAMPING COMPANY, INC.
- AD-VANCE MAGNETICS
- ALCO TECHNOLOGIES
- AMUNEAL MANUFACURING CORPORATION
- COILCRAFT, INC
- CUMING MICROWAVE CORPORATION
- CYBERSHIELD, INC
- DOW CORNING COROPORATION
- ELASTOMERIC SPECIALTIES, INC
- ENTHONE-OMI, INC
- ETS-LINDGREN
- FERRONICS, INC.
- FUJIPOLY AMERICA CORPORATION
- GREENE RUBBER COMPANY
- INTERMARK USA
- LAIRD TECHNOLOGIES
- LEADER TECH
- MAGNETIC SHIELD CORPORATION
- MAJR PRODUCTS
- MARIAN, INC
- MARTEK, INC.
- MICROSORB TECHNOLOGIES
- THE MUSHIELD COMPANY
- OMEGA SHIELDING PRODUCTS, INC.
- ORION INDUSTRIES, INC
- PANASHIELD, INC.
- PARKER CHOMERICS
- PREMIX THERMOPLASTICS
- PRESSCUT INDUSTRIES, INC.
- RTP, INC
- SAS INDUSTRIES, INC
- SCHAFFNER EMC, INC.
- SCHLEGEL SYSTEMS, INC
- SELECO, INC
- SHIELDEX TRADING USA
- STOCKWELL ELASTOMERICS, INC.
- SWIFT TEXTILE METALLING, LLC
- TDK CORPORATION OF AMERICA
- TECH-ETCH, INC.
- TECKNIT, INC
- 3M ELECTRICAL PRODUCTS DIVISION
- THRUST INDUSTRIES
- TUSONIX, INC
- VTI VACUUM TECHNOLOGIES
- ZIPPERTUBING COMPANY, INC.
- APPENDIX
- MAJOR PROFESSIONAL SOCIETIES
- IEEE EMC SOCIETY
- SAE
- SAE (Continued)
- ACRONYMS AND GLOSSARY OF TERMS
- ACRONYMS AND GLOSSARY OF TERMS